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Clear crafting of relay HKE
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relay HKE
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Release time:
2022-11-14
Soldering with no-clean flux should be used whenever possible, and bulk removal of the relay HKE should be avoided. Prevent the cleaning fluid from entering the relay HKE and causing it to fail. It is forbidden to use ultrasonic cleaning to prevent ultrasonic mechanical energy from causing point-contact spray welding, wire-wrapped wire breakage and other structural damage. Immediately after cleaning and drying, ventilation should be performed to bring the relay HKE down to room temperature.
Sometimes in order to ensure the moisture resistance and high cable sheath of small and medium-sized pcb circuit boards, it is necessary to apply protective agent to small and medium-sized pcb circuit boards. Softer glue without silicon should be used, and the production process of automatic dispensing machine should avoid relay HKE. Inhalation of protective agent due to negative working pressure.
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